 |
|
|
|
| Technology |
|
Prototyping/Small Volume |
|
Production/High Volume |
|
| Layer Count: |
|
44 |
|
44 |
|
| Track/Gap: |
|
2/2 |
|
2/2 |
|
| Drilling: |
|
Laser Microvia 0.002” |
|
Laser Microvia 0.002” |
|
| Impedance Control: |
|
Yes |
|
Yes |
|
| HDI: |
|
3+n+3 |
|
3+n+3 |
|
| Blind and Burieds: |
|
Both |
|
Both |
|
| Plugged Vias: |
|
Yes |
|
Yes |
|
| Max Thickness: |
|
10mm |
|
8mm |
|
| Materials: |
|
FR4, HiTg FR4, Rogers, Taconic, Arlon, Polyimide, BT Epoxy, Isola640, Getek |
|
FR4, HiTg FR4, Rogers, Taconic, Arlon, Polyimide |
|
| Finished: |
|
Immersion Gold, Flash Gold, Silver, Tin, Leadfree HAL, OSP |
|
Immersion Gold, Flash Gold, Silver, Tin, Leadfree HAL, OSP |
|
| Copper thickness: |
|
8oz |
|
8oz |
|
|
|
|
|
