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Technology   Prototyping/Small Volume   Production/High Volume

Layer Count:   44   44

Track/Gap:   2/2   2/2

Drilling:   Laser Microvia 0.002”   Laser Microvia 0.002”

Impedance Control:   Yes   Yes

HDI:   3+n+3   3+n+3

Blind and Burieds:   Both   Both

Plugged Vias:   Yes   Yes

Max Thickness:   10mm   8mm

Materials:   FR4, HiTg FR4, Rogers, Taconic, Arlon, Polyimide, BT Epoxy, Isola640, Getek   FR4, HiTg FR4, Rogers, Taconic, Arlon, Polyimide

Finished:   Immersion Gold, Flash Gold, Silver, Tin, Leadfree HAL, OSP   Immersion Gold, Flash Gold, Silver, Tin, Leadfree HAL, OSP

Copper thickness:   8oz   8oz

 

 

 

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